What is 3D Integrated Circuits
What is "3D Integrated Circuits?" 3D Integrated Circuits (3D ICs) are advanced semiconductor devices that stack multiple layers of circuitry vertically, instead of traditional planar (2D) integration. In a 3D IC, multiple dies or chips are vertically interconnected using through-silicon vias (TSVs) or other vertical interconnects, forming a three-dimensional structure. 3d ic The concept behind 3D ICs is to improve performance, increase functionality, and reduce the overall footprint of integrated circuits. By stacking multiple layers of circuitry, designers can achieve higher device density, shorter interconnect lengths, and improved interconnection bandwidth, resulting in faster data transfer and reduced power consumption. There are different approaches to 3D IC integration, including the following: TSV-Based 3D ICs: Through-silicon vias (TSVs) are vertical interconnects that pass through the silicon substrate, connecting different layers of the inte...